PCB design, PCB fabrication and PCB assembly
Smartnoble offers the turkey solutions of electronic manufacturing services, from PCB design, PCB fabrication to PCB assembly.
Smartnoble PCB Fabrication Capability
Smartnoble PCB Fabrication Capability
| Items | Mass | Sample | |
| Layers | 2~68L | 120L | |
| Max. Board Thickness | 10mm（394mil） | 14mm（551mil） | |
| Min. Width | Inner Layer | 2.2mil/2.2mil | 2.0mil/2.0mil |
| Outer Layer | 2.5/2.5mil | 2.2/2.2mil | |
| Registration | Same Core | ±25um | ±20um |
| Layer to Layer | ±5mil | ±4mil | |
| Max. Copper Thickness | 6Oz | 30Oz | |
| Min. Drill Hole Dlameter | Mechanical | ≥0.15mm(6mil) | ≥0.1mm(4mil) |
| Laser | 0.1mm（4mil） | 0.050mm（2mil） | |
| Max. Size (Finish Size) | Line-card | 850mmX570mm | 1000mmX600mm |
| Backplane | 1250mmX570mm | 1320mmX600mm | |
| Aspect Ratio (Finish Hole) | Line-card | 20:1 | 28:1 |
| Backplane | 25:1 | 35:1 | |
| Material | FR4 | EM827, 370HR, S1000-2, IT180A, EM825, IT158, S1000 / S1155, R1566W, EM285, TU862HF | |
| High Speed | Megtron6, Megtron4, Megtron7,TU872SLK, FR408HR,N4000-13 Series,MW4000,MW2000,TU933 | ||
| High Frequency | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 | ||
| Others | Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega , ZBC2000, | ||
| Surface Finish | HASK, ENIG, Immersion Tin, OSP, Immersion Silve, Gold Finger, Electroplating Hard Gold/Soft Gold, Selective OSP，ENEPIG | ||
PCB Assembly Shop
PCBA Process Capability
| PCB Assembly Capability | ||||
| Item | Lot Size | |||
| Normal | Special | |||
| PCB(used for SMT)spec | (L*W) | Min | L≥3mm | L＜2mm |
| W≥3mm | ||||
| Max | L≤1200mm | L ＞ 1200mm | ||
| W≤500mm | W＞ 500mm | |||
| (T) | Min thickness | 0.2mm | T＜0.1mm | |
| Max thickness | 4.5mm | T＞4.5mm | ||
| SMT components spec | outline dimension | Min size | 201 | 1005 |
| (0.6mm*0.3mm) | （0.3mm*0.2mm) | |||
| Max size | 200mm*125mm | 200mm*125mm＜SMD | ||
| component thickness | T≤6.5mm | 6.5mm＜T≤15mm | ||
| QFP、SOP、SOJ(multi pins) | Min pin space | 0.4mm | 0.3mm≤Pitch＜0.4mm | |
| CSP,BGA | Min ball space | 0.5mm | 0.3mm≤Pitch＜0.5mm | |
| DIP PCB SPEC | (L*W) | Min Size | L≥50mm | L＜50mm |
| W≥30mm | ||||
| Max Size | L≤1200mm | L≥1200mm | ||
| W≤500mm | W≥500mm | |||
| (T) | Minimum Thickness | 0.8mm | T＜0.8mm | |
| Maximum Thickness | 2mm | T＞2mm | ||
| BOX BULID | FIRMWARE | Provide programming firmware files,Firmware + software installation instructions | ||
| Function test | Level of testing required along with test instructions | |||
| Plastic & Metal Casings | Metal Casting,Sheet Metal work,Metal Fabrication,Metal Fabrication,Metal and plastic extrusion | |||
| BOX BUILD | 3D CAD model of enclosure + specifications (include drawings, size, weight, colour, material, finish, IP rating, etc) | |||
| PCBA FILES | PCB FILE | PCB Altium/Gerber/Eagle files (Including specs such as thickness, copper thickness, solder mask colour, finish, etc) | ||
